BluetoothWorld hero image

product launches

Bluetooth World will see the launch of a number of products and you will be one of the first to see them in person!

Book FREE tickets to meet the vendors who have developed the various chips, semi conductors, beacons and sensors, and learn how you can implement them into your new products.

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Cambridge Consultants

Cambridge Consultants make a special announcement at the show, launching a platform to help semiconductor companies and product manufacturers to develop new and disruptive Bluetooth technologies. This will be demonstrated at booth 216.

This will accompany demonstrations of Cambridge Consultants' ultra-low power AI and the world's lowest power Voice Activity Detection (VAD).

Find out more about Cambridge Consultants

Ellisys

 

Qualifier

Ellisys will showcase its recently released Bluetooth® Vanguard™ at Bluetooth World 2018.

Vanguard provides synchronized capture and analysis of BR/EDR, Bluetooth Low Energy, Wi-Fi 802.11 a/b/g/n/ac (3x3), WPAN 802.15.4 (all 16 2.4 GHz channels), raw 2.4 GHz RF spectrum analysis, HCI (USB, UART, SPI), generic SPI/UART/I2C/SWD communications, WCI-2, logic signals, and Audio I2S.

Powerful Ellisys Features:

  • Bluetooth Wideband Capture: Easy and rock-solid capture of any traffic on all channels, including discovery/connection traffic and complex topologies
  • Wi-Fi 802.11 a/b/g/n/ac (3x3) Capture: Extremely accurate and perfectly synchronized Wi-Fi capture accelerated by Ellisys hardware protocol engine for best-in-class performance
  • WPAN 802.15.4 Wideband Capture: Concurrent capture of all 16 WPAN 2.4 GHz channels for an unmatched coexistence analysis capability
  • Connection / Power Flexibility: Connect, control, and power the system locally or remotely via networkable GbE (with Power-over-Ethernet/PoE) or USB 3.1 over Type-C™ (with USB Power Delivery)
  • Mesh Support: Includes full support for Bluetooth Mesh network topologies

 

Learn more about how Vanguard’s deep feature set gives developers a powerful solution designed to meet the broad array of design and testing challenges presented by the latest in wireless technologies, such as mesh technology, increased security features, IoT applications, multi-protocol radios, and coexistence challenges at stand 122.

Find out more about Ellisys

Insight SIP

Insight SIP will be launching the 1507-AL Bluetooth module. This module offers low cost, high advanced Bluetooth. Based on the class leading Nordic Semiconductor nRF52 series, this module provides a complete solution, with an embedded antenna, integrated DC-DC converter, and both crystals for synchronization and radio. This module is ideal for situations where customers want to add wireless connectivity to an existing solution, or for new applications with standard memory requirements where nevertheless features, performance, and long battery life remain important.

Find out more about Insight SIP

Nordic Semiconductor

 

 

Nordic Semiconductor will be showcasing the nRF52840 Dongle. It is a small, low-cost USB dongle for Bluetooth® low energy, Bluetooth mesh, Thread, ZigBee, 802.15.4, ANT and 2.4GHz proprietary applications using the nRF52840 SoC.

  • nRF52840 DongleLow cost USB dongle supporting Bluetooth low energy, Thread, Zigbee, 802.15.4, ANT and 2.4GHz
  • 15 GPIO and interfaces available on castellated edge soldering points
  • 1 Programmable RGB LED
  • 1 Programmable green LED
  • 1 Programmable Button
  • Updatable through USB DFU

 

Find out more about Nordic Semiconductor

O2Micro

O2Micro will launch its Bluetooth low energy (LE) chip OZ950 at Bluetooth World 2018. It is the world's O2 Micro Chipsmallest, lowest power and most integrated Bluetooth LE solution and offers the following highlights:

  • Highly integrated Bluetooth 4.2 LE SoC
  • Supports Bluetooth Mesh and Master/Slave
  • Extreme low power
  • Support 31 GPIOs with interrupt function
  • Rich interface resource, customized profile to support Bluetooth LE application
  • Superior performance for IoT applications such as smart home, wearables, beacons, consumer electronics (CE) remote controls

 

Learn more about what this chip will do and how you can use it, face-to-face with the company that developed it at Bluetooth World 2018.

Find out more about O2Micro

O2Micro

GPS chipO2Micro will launch its GPS chip at Bluetooth World 2018. It's a high-performance, multi-GNSS solutions with the industry's leading sensitivity, accuracy and Time to First Fix and offers the following highlights:

  • GNSS engine for both GPS and COMPASS
  • World's first 'Instant Boot' with patent, quick boot and positioning
  • Industry's highest level of sensitivity, accuracy and Time to First Fix (TTFF)
  • Originated 'NSP' co-processor architectue, applicable for all Android applications
  • Minimal e-BOM, as few as 8 external parts, significant cost reductions
  • Superior performance for car navigation, bike-sharing, tracking and wrist worn.

 

Learn more about what this chip will do and how you can use it, face-to-face with the company that developed it at Bluetooth World 2018.

Find out more about O2Micro

Rohde & Schwarz

R&S CMW270Rohde & Schwarz will present the world's first signaling test solution for Bluetooth® LE.

Many manufacturers of Bluetooth LE components find it challenging to test modules and sensors in compliance with the standard. These devices often have no connection for a control line, which is necessary for testing them in direct test mode (DTM) as stipulated by the Bluetooth LE standard. The R&S CMW270 wireless connectivity tester from Rohde & Schwarz now enables over-the-air (OTA) tests on Bluetooth LE devices, same as for Bluetooth Classic devices, a function already implemented in the tester.

Discover more about the R&S CMW270 and its full range of functions at Bluetooth World 2018.

Find out more about Rohde & Schwarz

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